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Equipment performance

Adjustable transmission speed：0.5-3m/min

Normal operating speed：2.5m/min

capacity： Up to 4000 Wafers/H@20mm

           Up to 6800 Wafers/H@20mm

           Up to 8000 Wafers/H@20mm

Effective utilization rate of equipment：≥98%

Etching depth range：3.5~4.5μm

Fragment rate：≤0.03%

Silicon wafer specification

Silicon wafer thickness: ≥ 140 μ m

Silicon wafer size: 156.75 * 156.75mm-212 * 212mm

Equipment size 

Length * width * height: determine the size according to the model selection

transmission

Transmission type: 5 lane / 6 Lane

Shaft spacing: 60mm

Main drive shaft: 17mm, hexagon

Drive roller: Φ 32mm

direction

Working direction：Left→Right  / Right→Left（TBD）

power supply

Power supply: AC380V 3Ph + PE + n 50Hz (TBD)

Control power supply: DC 24V

Full load power supply: 75A

Recommended maximum fuse size: 100A

Installation requirements

Minimum ground bearing capacity: 75kg / ㎡

Minimum workshop height: 3.5m

Clean room level: iso7 (10K class)

Ambient temperature: 17 ℃＜ RT ＜ 30 ℃

Maximum humidity: 70%